Features
Buffered memory type	Unregistered (unbuffered)
CAS latency	11
Internal memory	8 GB
Memory layout (modules x size)	1 x 8 GB
Internal memory type	DDR3L
Memory clock speed	1600 MHz
Component for	Laptop
Memory form factor	204-pin SO-DIMM
ECC
Memory bus	64 bit
Memory voltage	1.35, 1.5 V
Module configuration	1G X 64
Row cycle time	48,125 ns
Refresh row cycle time	260 ns
Row active time	35 ns

Features
Country of origin	Taiwan
Lead plating	Gold

Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C

Weight & dimensions
Width	67,6 mm
Height	30 mm

Logistics data
Harmonized System (HS) code	84733020

Other features
Chips organization	X8
Bus clock rate	1600 MHz
Error indication
Memory layout	1 x 8192 MB
Internal memory	8192 MB